Surface-Mount (SMT)
Fine-pitch, uBGA/CSP/QFN, 01005 passives with cavity-reduced reflow profiles.
- SPI → high-speed placement → reflow
- 3D-AOI & X-ray for BGAs/BTC
End-to-end electronics manufacturing: DFM, sourcing, SMT/THT assembly, testing and box build. From quick-turn prototypes to production PCBA — documented, reliable and repeatable.
Short tour of SPI → pick & place → reflow → AOI/X-ray → functional test → box build.
Fine-pitch, uBGA/CSP/QFN, 01005 passives with cavity-reduced reflow profiles.
Selective, wave, or controlled hand soldering with dedicated fixtures and AOI.
Rigid-flex & flex, press-fit, shields, heatsinks, LED optics, magnetics integration.
Fast stencils, quick kitting, clear build notes; EVT bring-up and rework support.
ICT, flying-probe, boundary-scan, FCT with firmware flash; IPC-A-610 Class 2/3.
Full or partial turnkey: BOM sourcing, incoming QC, manufacturing and logistics.
Quick answers on terminology, options and lead times.
Share data (Gerbers, BOM, pick-files, assembly notes), target quantities and any test or coating requirements. We’ll provide DFM feedback and a firm quote.
Send your request to office@tps-elektronik.com.