{"id":16232,"date":"2026-09-01T09:00:00","date_gmt":"2026-09-01T07:00:00","guid":{"rendered":"https:\/\/tps-elektronik.com\/?post_type=case_studies&#038;p=16232"},"modified":"2026-08-13T02:45:12","modified_gmt":"2026-08-13T00:45:12","slug":"how-to-integrate-liquid-cooling-manifolds-into-copper-aluminum-hybrid-server-enclosures-for-high-density-gpu-data-centers-with-tps-advanced-metal-fabrication","status":"publish","type":"case_studies","link":"https:\/\/tps-elektronik.com\/en\/case-studies\/how-to-integrate-liquid-cooling-manifolds-into-copper-aluminum-hybrid-server-enclosures-for-high-density-gpu-data-centers-with-tps-advanced-metal-fabrication\/","title":{"rendered":"How to Integrate Liquid Cooling Manifolds into Copper-Aluminum Hybrid Server Enclosures for High Density GPU Data Centers with TPS Advanced Metal Fabrication?"},"content":{"rendered":"<article class=\"blog-post\" lang=\"en\"><header>\n<p>For system integrators, panel builders, and procurement teams in the high-density data center industry, the transition from air-cooled to liquid-cooled server infrastructure is not a trend\u2014it is a necessity driven by the thermal demands of AI and GPU computing. A single NVIDIA B200 GPU operates at 1,000W TDP, and a fully populated rack can exceed 100kW of power consumption, making traditional air cooling inadequate.<\/p>\n<p>TPS Elektronik&#8217;s <strong>custom sheet metal fabrication<\/strong> service was engaged by an anonymous hyperscale data center operator to design and manufacture a <strong>copper-aluminum hybrid server enclosure<\/strong> with integrated liquid cooling manifolds for high-density GPU clusters. The challenge: combine the thermal conductivity of copper with the lightweight structural properties of aluminum in a single enclosure that met ORv3 rack specifications and passed stringent leak testing\u2014from prototype to volume production.<\/p>\n<p><a class=\"cta-primary\" href=\"https:\/\/tps-elektronik.com\/en\/services\/ems\/sheet-metal-processing\/\">Request a custom metal enclosure quote \u2192<\/a><\/p>\n<\/header><nav class=\"toc\" aria-label=\"Table of contents\">\n<h2 id=\"toc\">Table of Contents<\/h2>\n<ol>\n<li><a href=\"#the-challenge\">The Challenge: Liquid Cooling Integration in High-Density GPU Racks<\/a><\/li>\n<li><a href=\"#the-solution\">The TPS Solution: Copper-Aluminum Hybrid Enclosure Design<\/a><\/li>\n<li><a href=\"#manufacturing-approach\">Manufacturing Approach: Precision Metal Fabrication for Liquid Cooling<\/a><\/li>\n<li><a href=\"#integration-outcomes\">Integration and Outcomes: Meeting ORv3 Compliance and Thermal Targets<\/a><\/li>\n<li><a href=\"#tps-capabilities\">TPS Advanced Metal Fabrication Capabilities for Liquid-Cooled Enclosures<\/a><\/li>\n<li><a href=\"#faq\">FAQ<\/a><\/li>\n<\/ol>\n<\/nav>\n<section id=\"the-challenge\">\n<h2>1. The Challenge: Liquid Cooling Integration in High-Density GPU Racks<\/h2>\n<p>The customer\u2014a hyperscale data center operator deploying AI training clusters\u2014faced a critical infrastructure challenge: their existing server enclosures could not accommodate the liquid cooling infrastructure required for next-generation GPU servers. Direct-to-chip liquid cooling requires <strong>liquid cooling manifolds<\/strong> that distribute coolant to individual cold plates mounted on each GPU, creating a complex network of fluid connections within the server chassis.<\/p>\n<p>Key requirements included:<\/p>\n<ul>\n<li><strong>Integrated liquid cooling manifolds:<\/strong> The enclosure must house coolant distribution manifolds with leak-proof connections<\/li>\n<li><strong>Copper-aluminum hybrid construction:<\/strong> Copper cold plates for maximum thermal conductivity; aluminum frame for lightweight structural integrity<\/li>\n<li><strong>ORv3 rack compliance:<\/strong> Enclosure dimensions and mounting interfaces must meet Open Compute Project Open Rack V3 specifications<\/li>\n<li><strong>High density:<\/strong> Support for multiple GPU servers per enclosure with minimal footprint<\/li>\n<li><strong>Leak-proof integration:<\/strong> All fluid connections must pass pressure and leak testing before deployment<\/li>\n<\/ul>\n<p>Traditional stamped or formed steel enclosures could not meet these requirements. Customer needed a partner capable of precision metal fabrication across dissimilar materials\u2014copper and aluminum\u2014with integrated fluid path machining and assembly.<\/p>\n<p>TPS Elektronik was engaged to develop a <strong>custom metal enclosure<\/strong> solution that would integrate liquid cooling manifolds into a copper-aluminum hybrid chassis, supporting the customer&#8217;s transition to liquid-cooled AI infrastructure.<\/p>\n<p><img decoding=\"async\" class=\"alignnone size-full wp-image-16330\" src=\"https:\/\/tps-elektronik.com\/wp-content\/uploads\/2026\/08\/Copper-Aluminum-Hybrid-Server-Enclosure-with-Liquid-Cooling-Manifold-1-1.jpg\" alt=\"Copper-Aluminum Hybrid Server Enclosure with Liquid Cooling Manifold Hybrid-Servergeh\u00e4use aus Kupfer und Aluminium mit Fl\u00fcssigkeitsk\u00fchlverteiler\" width=\"1920\" height=\"1079\" \/><\/p>\n<p><a class=\"cta-primary\" href=\"https:\/\/tps-elektronik.com\/en\/custom-sheet-metal-fabrication-precision-manufacturing\/\">Learn more about TPS custom sheet metal fabrication \u2192<\/a><\/p>\n<\/section>\n<section id=\"the-solution\">\n<h2>2. The TPS Solution: Copper-Aluminum Hybrid Enclosure Design<\/h2>\n<p>TPS Elektronik&#8217;s approach combined sheet metal fabrication expertise with thermal management engineering to deliver a <strong>copper-aluminum hybrid server enclosure<\/strong> that met all customer requirements.<\/p>\n<p><strong>Design &amp; Engineering:<\/strong><\/p>\n<ul>\n<li><strong>Hybrid material strategy:<\/strong> Copper cold plates and fluid channels for optimal thermal conductivity; aluminum frame and structural members for weight reduction<\/li>\n<li><strong>Integrated manifold design:<\/strong> Coolant distribution channels machined directly into the enclosure structure, eliminating separate manifold components<\/li>\n<li><strong>ORv3 compliance:<\/strong> Enclosure designed to meet Open Rack V3 mechanical specifications, including mounting interfaces and dimensional requirements<\/li>\n<li><strong>Leak-proof sealing:<\/strong> O-ring grooves and sealing surfaces machined to tight tolerances for reliable fluid connections<\/li>\n<\/ul>\n<p><strong>Material Selection:<\/strong><\/p>\n<ul>\n<li><strong>Copper (C11000):<\/strong> Cold plates and fluid channels for maximum thermal conductivity (401 W\/m\u00b7K)<\/li>\n<li><strong>Aluminum (6061-T6):<\/strong> Frame and structural components for lightweight strength and corrosion resistance<\/li>\n<li><strong>Dissimilar metal joining:<\/strong> Transition interfaces designed to manage thermal expansion differences between copper and aluminum<\/li>\n<\/ul>\n<p>For <strong>copper-aluminum hybrid chassis<\/strong> applications, managing the thermal expansion mismatch between the two metals is critical. Copper expands at approximately 16.5 \u00b5m\/m\u00b7K, while aluminum expands at 23.1 \u00b5m\/m\u00b7K\u2014a difference that can cause joint failure if not properly designed. TPS&#8217;s engineering team addressed this through carefully designed transition interfaces and joining techniques that accommodate differential expansion.<\/p>\n<p><img decoding=\"async\" class=\"alignnone size-full wp-image-16325\" src=\"https:\/\/tps-elektronik.com\/wp-content\/uploads\/2026\/08\/Copper-Aluminum-Hybrid-Chassis-Liquid-Cooling-Integration-Diagram-2-1.jpg\" alt=\"Copper-Aluminum Hybrid Chassis Liquid Cooling Integration Diagram Integrationsdiagramm f\u00fcr Fl\u00fcssigkeitsk\u00fchlung in einem Hybridgeh\u00e4use aus Kupfer und Aluminium\" width=\"1920\" height=\"1079\" \/><\/p>\n<\/section>\n<section id=\"manufacturing-approach\">\n<h2>3. Manufacturing Approach: Precision Metal Fabrication for Liquid Cooling<\/h2>\n<p>TPS Elektronik&#8217;s <strong>custom sheet metal fabrication<\/strong> capability was critical to the success of this project. The manufacturing process encompassed multiple precision operations:<\/p>\n<p><strong>Cutting &amp; Forming:<\/strong><\/p>\n<ul>\n<li><strong>Fiber laser cutting:<\/strong> Precision cutting of aluminum and copper sheets with \u00b10.1\u20130.2 mm tolerance<\/li>\n<li><strong>CNC press brake bending:<\/strong> Forming of complex enclosure geometries with bend angles maintained within \u00b10.5\u00b0<\/li>\n<li><strong>CNC machining:<\/strong> Precision milling of fluid channels, sealing surfaces, and mounting interfaces<\/li>\n<\/ul>\n<p><strong>Joining &amp; Assembly:<\/strong><\/p>\n<ul>\n<li><strong>TIG welding:<\/strong> Precision welding of copper components and aluminum frame members<\/li>\n<li><strong>Dissimilar metal joining:<\/strong> Specialized techniques for copper-aluminum transition joints<\/li>\n<li><strong>Hardware insertion:<\/strong> PEM inserts and threaded fasteners for component mounting<\/li>\n<\/ul>\n<p><strong>Finishing &amp; Testing:<\/strong><\/p>\n<ul>\n<li><strong>Surface finishing:<\/strong> Deburring, blasting, and powder coating for corrosion resistance and aesthetics<\/li>\n<li><strong>Pressure testing:<\/strong> Leak testing of all fluid channels at 1.5\u00d7 operating pressure<\/li>\n<li><strong>First Article Inspection (FAI):<\/strong> Comprehensive dimensional reports per AS9100 requirements<\/li>\n<\/ul>\n<p>For <strong>liquid-cooled server enclosure metal<\/strong> applications, the integration of fluid paths into the metal structure requires exceptional precision. TPS&#8217;s in-house metal fabrication capabilities\u2014including CNC machining of cooling channels directly into copper and aluminum\u2014enabled the customer to eliminate separate manifold components, reducing assembly complexity and potential leak points.<\/p>\n<p>TPS&#8217;s integrated EMS approach meant that sheet metal fabrication was coordinated with broader system requirements, including PCB mounting, cable routing, and thermal interface management. Our <a href=\"https:\/\/tps-elektronik.com\/en\/ems-sheet-metal-processing-rfq-ready-cnc-bending\/\">EMS sheet metal processing<\/a> service provided the end-to-end workflow from RFQ to inspected production.<\/p>\n<p><img decoding=\"async\" class=\"alignnone size-full wp-image-14589\" src=\"https:\/\/tps-elektronik.com\/wp-content\/uploads\/2026\/06\/Fiber-Laser-Cutting-Precision-Aluminum-Plate-Electronics-Enclosure-Sheet-Metal-Fabrication-\u2013-TPS-Elektronik-2.jpg\" alt=\"Fiber Laser Cutting Precision Aluminum Plate Electronics Enclosure Sheet Metal Fabrication \u2013 TPS Elektronik Faserlaserschneiden Pr\u00e4zisions-Aluminiumplatte Elektronikgeh\u00e4use Blechfertigung \u2013 TPS Elektronik\" width=\"1920\" height=\"1078\" \/><\/p>\n<\/section>\n<section id=\"integration-outcomes\">\n<h2>4. Integration and Outcomes: Meeting ORv3 Compliance and Thermal Targets<\/h2>\n<p>The copper-aluminum hybrid server enclosure delivered by TPS Elektronik exceeded the customer&#8217;s performance targets while meeting all ORv3 compliance requirements.<\/p>\n<p><strong>Key Outcomes:<\/strong><\/p>\n<ul>\n<li><strong>ORv3 compliance:<\/strong> Enclosure met all Open Rack V3 mechanical specifications, including mounting interfaces and dimensional requirements<\/li>\n<li><strong>Thermal performance:<\/strong> Integrated copper cold plates achieved thermal resistance below 0.05 K\/W, enabling GPU operation at full TDP<\/li>\n<li><strong>Leak integrity:<\/strong> All fluid channels passed 1.5\u00d7 operating pressure testing with zero leakage<\/li>\n<li><strong>Weight reduction:<\/strong> Aluminum frame reduced enclosure weight by approximately 30% compared to all-copper or all-steel designs<\/li>\n<li><strong>Assembly simplification:<\/strong> Integrated manifold design eliminated separate manifold components, reducing assembly time by 25%<\/li>\n<\/ul>\n<p><strong>Operational Benefits:<\/strong><\/p>\n<ul>\n<li><strong>Reduced cooling energy:<\/strong> Direct-to-chip liquid cooling enabled by the integrated manifold reduced cooling energy consumption by up to 30%<\/li>\n<li><strong>Higher rack density:<\/strong> The compact enclosure design supported more GPU servers per rack<\/li>\n<li><strong>Simplified maintenance:<\/strong> Integrated manifold design with leak-proof connections reduced maintenance complexity<\/li>\n<\/ul>\n<p>This case study demonstrates how TPS Elektronik combines expertise in <strong>custom metal enclosures for electronics<\/strong>, precision sheet metal fabrication, and thermal management engineering to deliver integrated solutions for high-density data center applications. By integrating liquid cooling manifolds directly into the enclosure structure, TPS helped the customer transition from air-cooled to liquid-cooled AI infrastructure with minimal disruption.<\/p>\n<p><a class=\"cta-primary\" href=\"https:\/\/tps-elektronik.com\/en\/services\/ems\/sheet-metal-processing\/\">Request a custom metal enclosure quote \u2192<\/a><\/p>\n<\/section>\n<section id=\"tps-capabilities\">\n<h2>5. TPS Advanced Metal Fabrication Capabilities for Liquid-Cooled Enclosures<\/h2>\n<p>TPS Elektronik&#8217;s <strong>custom sheet metal fabrication<\/strong> service for liquid-cooled server enclosures combines precision manufacturing, material expertise, and thermal management engineering in a single integrated workflow.<\/p>\n<p><strong>Manufacturing Capabilities:<\/strong><\/p>\n<ul>\n<li><strong>Fiber laser cutting:<\/strong> Precision cutting of aluminum, copper, and steel with \u00b10.1\u20130.2 mm tolerance<\/li>\n<li><strong>CNC press brake bending:<\/strong> Complex geometries with bend angles \u00b10.5\u00b0<\/li>\n<li><strong>CNC machining:<\/strong> Precision milling of fluid channels, sealing surfaces, and mounting interfaces<\/li>\n<li><strong>TIG and MIG welding:<\/strong> Precision welding of copper, aluminum, and steel components<\/li>\n<li><strong>Surface finishing:<\/strong> Deburring, blasting, powder coating, and anodizing<\/li>\n<li><strong>Assembly:<\/strong> Hardware insertion, component mounting, and final assembly<\/li>\n<\/ul>\n<p><strong>Specialized Capabilities for Liquid Cooling:<\/strong><\/p>\n<ul>\n<li><strong>Copper-aluminum hybrid fabrication:<\/strong> Precision joining of dissimilar metals with thermal expansion management<\/li>\n<li><strong>Integrated fluid channel machining:<\/strong> CNC milling of coolant channels directly into enclosure structures<\/li>\n<li><strong>Leak-proof sealing surfaces:<\/strong> Precision machining of O-ring grooves and sealing interfaces<\/li>\n<li><strong>Pressure testing:<\/strong> Leak testing of all fluid channels at 1.5\u00d7 operating pressure<\/li>\n<\/ul>\n<p><strong>Quality &amp; Compliance:<\/strong><\/p>\n<ul>\n<li><strong>ISO 9001 and IATF 16949:<\/strong> Quality management systems<\/li>\n<li><strong>First Article Inspection (FAI):<\/strong> Comprehensive dimensional reports<\/li>\n<li><strong>Material certificates:<\/strong> Full traceability of material provenance<\/li>\n<li><strong>PPAP:<\/strong> Production Part Approval Process available on request<\/li>\n<\/ul>\n<p>TPS supports both prototype and production volumes, with scalable manufacturing capacity for liquid-cooled enclosure programs of any size. TPS&#8217;s <strong>custom sheet metal fabrication<\/strong> service is integrated with broader EMS capabilities\u2014including cable assembly, PCB assembly, and system integration\u2014reducing supply chain complexity for system integrators and procurement teams.<\/p>\n<p>For <strong>GPU data center metal enclosure<\/strong> applications, TPS&#8217;s <a href=\"https:\/\/tps-elektronik.com\/en\/services\/ems\/sheet-metal-processing\/\">sheet metal processing<\/a> and <a href=\"https:\/\/tps-elektronik.com\/en\/custom-sheet-metal-fabrication-precision-manufacturing\/\">custom metal fabrication<\/a> capabilities provide a comprehensive solution from design to production.<\/p>\n<p><a class=\"cta-primary\" href=\"https:\/\/tps-elektronik.com\/en\/services\/ems\/sheet-metal-processing\/\">Get your custom metal enclosure RFQ in 24\u201348 hours \u2192<\/a><\/p>\n<\/section>\n<section id=\"faq\">\n<h2>6. FAQ<\/h2>\n<div>\n<div>\n<h3>What is a copper-aluminum hybrid server enclosure and why is it used for liquid cooling?<\/h3>\n<div>\n<div>A copper-aluminum hybrid server enclosure combines copper cold plates and fluid channels (for maximum thermal conductivity) with an aluminum frame (for lightweight structural integrity). This hybrid approach enables efficient direct-to-chip liquid cooling while maintaining manageable enclosure weight, making it ideal for high-density GPU data centers where rack weight limits are a constraint.<\/div>\n<\/div>\n<\/div>\n<div>\n<h3>What is ORv3 and why is it important for server enclosures?<\/h3>\n<div>\n<div>ORv3 (Open Rack V3) is an Open Compute Project specification that defines mechanical, electrical, and thermal standards for rack-mounted server equipment. ORv3-compliant enclosures ensure interoperability across different manufacturers and support higher power densities, including 48V and 54V power distribution and liquid cooling integration.<\/div>\n<\/div>\n<\/div>\n<div>\n<h3>How does TPS manage the thermal expansion difference between copper and aluminum in hybrid enclosures?<\/h3>\n<div>\n<div>Copper expands at approximately 16.5 \u00b5m\/m\u00b7K while aluminum expands at 23.1 \u00b5m\/m\u00b7K. TPS manages this difference through carefully designed transition interfaces between the two materials, specialized joining techniques, and mechanical designs that accommodate differential expansion without compromising structural integrity or leak-proof sealing.<\/div>\n<\/div>\n<\/div>\n<div>\n<h3>What testing is performed on liquid-cooled server enclosures?<\/h3>\n<div>\n<div>TPS performs pressure testing of all fluid channels at 1.5\u00d7 operating pressure with zero leakage, First Article Inspection (FAI) with comprehensive dimensional reports, material certificate verification, and optional PPAP documentation. Additional thermal performance testing may be performed per customer requirements.<\/div>\n<\/div>\n<\/div>\n<div>\n<h3>Can TPS support both prototype and volume production of liquid-cooled enclosures?<\/h3>\n<div>\n<div>Yes. TPS supports both prototype development\u2014with DFM feedback and rapid iteration\u2014and volume production with scalable manufacturing capacity. This single-source approach reduces supply chain complexity and ensures consistency from development to production.<\/div>\n<\/div>\n<\/div>\n<div>\n<h3>What materials does TPS use for liquid-cooled server enclosures?<\/h3>\n<div>\n<div>TPS works with oxygen-free copper (C11000) for cold plates and fluid channels, aluminum (6061-T6) for structural frames, and a range of steels and stainless steels for other components. Material selection is tailored to specific thermal, mechanical, and cost requirements for each project.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n<footer style=\"background: #2d5797; padding: 30px; border-radius: 14px; margin-top: 40px;\">\n<p style=\"color: #ffffff; font-size: 16px; line-height: 1.6; margin: 0;\"><strong>Ready to integrate liquid cooling into your high-density GPU server enclosures?<\/strong><br \/>Contact TPS Elektronik for engineering consultation, prototype evaluation, and production support\u2014from copper-aluminum hybrid fabrication to integrated EMS assembly.<br \/><a style=\"color: #ffffff; font-weight: 600; text-decoration: underline;\" href=\"https:\/\/tps-elektronik.com\/en\/services\/ems\/sheet-metal-processing\/\">Request your custom metal enclosure quote \u2192<\/a><\/p>\n<\/footer><\/article>\n\n<style id=\"wpforms-css-vars-4659-block-d91560c1-8687-43d1-9f93-feadb0ea8d55\">\n\t\t\t\t#wpforms-4659.wpforms-block-d91560c1-8687-43d1-9f93-feadb0ea8d55 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center industry, the transition from air-cooled to liquid-cooled server infrastructure is not a trend\u2014it is a necessity driven by the thermal demands of AI and GPU computing. A single NVIDIA B200 GPU operates at 1,000W TDP, and a fully populated rack can exceed\u2026 <a href=\"https:\/\/tps-elektronik.com\/en\/case-studies\/how-to-integrate-liquid-cooling-manifolds-into-copper-aluminum-hybrid-server-enclosures-for-high-density-gpu-data-centers-with-tps-advanced-metal-fabrication\/\">Read More &raquo;<\/a><\/p>\n","protected":false},"author":9,"featured_media":14589,"template":"","class_list":["post-16232","case_studies","type-case_studies","status-publish","has-post-thumbnail","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>TPS Custom Metal Enclosures For Electronics - TPS<\/title>\n<meta name=\"description\" content=\"Custom metal enclosures for electronics with copper-aluminum hybrid chassis integrating liquid cooling manifolds for high-density GPU data centers.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/tps-elektronik.com\/en\/case-studies\/how-to-integrate-liquid-cooling-manifolds-into-copper-aluminum-hybrid-server-enclosures-for-high-density-gpu-data-centers-with-tps-advanced-metal-fabrication\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"TPS Custom Metal Enclosures For Electronics - 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