{"id":15179,"date":"2026-07-28T09:00:00","date_gmt":"2026-07-28T07:00:00","guid":{"rendered":"https:\/\/tps-elektronik.com\/?post_type=case_studies&p=15179"},"modified":"2026-06-30T09:43:36","modified_gmt":"2026-06-30T07:43:36","slug":"how-a-global-laser-oem-achieved-ultra-high-power-density-with-tps-customized-power-supply-circuit-board-design-and-heavy-copper-assembly","status":"publish","type":"case_studies","link":"https:\/\/tps-elektronik.com\/en\/case-studies\/how-a-global-laser-oem-achieved-ultra-high-power-density-with-tps-customized-power-supply-circuit-board-design-and-heavy-copper-assembly\/","title":{"rendered":"How a Global Laser OEM Achieved Ultra\u2011High Power Density with TPS Customized Power Supply Circuit Board Design and Heavy Copper Assembly?"},"content":{"rendered":"
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System integrators and OEMs rarely fail because they lack a power conversion concept. They lose time\u2014and budget\u2014when the physical power supply circuit board cannot handle the thermal and current density required to meet aggressive size targets. A global manufacturer of high\u2011power industrial laser systems faced this exact barrier when developing a next\u2011generation laser driver. Their existing power supply design, built on a standard 2\u2011ounce copper PCB, was overheating and could not be shrunk into the smaller enclosure demanded by the market. The project risked a major delay.
TPS Elektronik\u2019s custom power supply circuit board design<\/strong> and heavy copper PCB assembly<\/strong> service eliminated this bottleneck. By re\u2011engineering the board with a 6\u2011layer, 6\u2011ounce copper construction, an optimized thermal layout, and embedded press\u2011fit power terminals, TPS delivered a power supply that met the ultra\u2011high power density target while passing full EMC and thermal validation. This case study describes the collaboration and the manufacturing techniques that made it possible.<\/p>\n

Request a custom power supply PCB consultation \u2192<\/a><\/p>\n<\/header>